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Xinfeng Huihe Circuits Co., Ltd.

Showing 31 - 40 of 69, total 7 pages        [First] [Previous] [Next] [Last]

31
communication equipment pcb
communication equipment pcb
Specification: 1
Detail: In order to shorten the signal transmission distance and reduce the signal transmission loss, the 5G communication PCB, gradually move towards high-density wiring, fine wire ***cing, the development of small aperture, thin pro...

32
6 layer hasl blind buried via pcb
6 layer hasl blind buried via pcb
Specification: 1
Detail: Number of layers: 6 Surface finish: HASL Base material: FR4 Outer Layer W/S: 9/4mil Inner layer W/S: 11/7mil Thickness:1.6mm Min. hole diameter: 0.3mm Special process: Blind Vias Advantages Of 6 Layer HASL Blind Bu...

33
6 layer hasl blind buried via pcbpcb circuitz
6 layer hasl blind buried via pcbpcb circuitz
Specification: 1
Detail: Number of layers: 6 Surface finish: HASL Base material: FR4 Outer Layer W/S: 9/4mil Inner layer W/S: 11/7mil Thickness:1.6mm Min. hole diameter: 0.3mm Special process: Blind Vias Advantages Of 6 Layer HASL Blind Buri...

34
14 layer blind buried via pcb
14 layer blind buried via pcb
Specification: 1
Detail: Own lamination process to convenient production for Multilayer PCB and shorten the lead time. Jiangxi facility is environmental-friendly approved by the government . Famous raw materials brand, Kingboard, Shengyi, ITEQ, Ta...

35
12 layer enig pcb
12 layer enig pcb
Specification: 1
Detail: Number of layers: 12 Surface finish: ENIG Base material: FR4 Outer Layer W/S: 7/4mil Inner layer W/S: 5/4mil Thickness:1.5mm Min. hole diameter: 0.25mm Special process: Blind Vias Advantages Of 12 Layer PCB Own la...

36
10 layer enig blind vias pcb
10 layer enig blind vias pcb
Specification: 1
Detail: Number of layers: 10 Surface finish: ENIG Base material: FR4 W/S: 4/4mil Thickness: 1.6mm Min. hole diameter: 0.2mm Special process: Blind Vias Advantages Of 10 Layer ENIG Blind Vias PCB Own lamination process to...

37
blind buried vias & hdi pcb
blind buried vias & hdi pcb
Specification: 1
Detail: Buried vias PCB & blind vias PCB, use micro blind vias to increase the trace distribution density. Improve radio frequency, electromagnetic wave interference and hear conduction. Apply to computer server, mobile phone and di...

38
automotive pcb
automotive pcb
Specification: 1
Detail: Automotive electronic products have different reliability requirements for automotive printed circuit board in different parts, Huihe CircuitsĄŻ car PCBs have passed the IATF16949 automotive quality management system standard,...

39
5g pcb
5g pcb
Specification: 1
Detail: HUIHE Circuits owns 5G circuit board PCB technology, Our VR PCB and AR PCB helps VR/AR, smart cities, smart agriculture, smart manufacturing, industrial Internet,The Internet of Vehicles, unmanned driving, smart home, and smar...

40
impedance control pcb
impedance control pcb
Specification: Impedance Control PCB
Detail: Differential Impedance: (Differential Impedance) the measured impedance between two conductors. Factors Affecting Impedance In PCB A: The dielectric constant (TMr) is ***ermined by the raw material. (Plate, prepreg) B: Circ...
Showing 31 - 40 of 69, total 7 pages        [First] [Previous] [Next] [Last]
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